die-and-wire bonding

die-and-wire bonding
lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die-and-wire bonding vok. Chip-und-Draht-Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce-fil, f

Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. . 2000.

Игры ⚽ Поможем написать курсовую

Look at other dictionaries:

  • Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics       Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity.       Computer scientist Manindra Agrawal of the… …   Universalium

  • Spider-Man's powers and equipment — The fateful spider bite that gave Peter Parker his powers. Amazing Fantasy #15, art by Steve Ditko. Spider Man s powers, abilities, and equipment are used by Marvel Comics superhero Spider Man in tandem to combat his many foes. He receives most… …   Wikipedia

  • Chip-und-Draht-Bonden — lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …   Radioelektronikos terminų žodynas

  • connexion puce-fil — lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …   Radioelektronikos terminų žodynas

  • lusto ir vielinių išvadų sujungimas — statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …   Radioelektronikos terminų žodynas

  • соединение кристалла ИС и проволочных выводов — lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …   Radioelektronikos terminų žodynas

  • QFN — A QFN or Quad Flat No leads or a MLF package is an integrated circuit package which falls under Surface mount technology packages used on printed circuit boards. This kind of package is similar to the Quad Flat Package, but the leads do not… …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Nacktchipmontage — Die Chip on Board Technologie (Abk.: COB, deutsch Nacktchipmontage) ist eine Technologie zur Montage von ungehäusten Halbleiter Chips auf Leiterplatten zu einer elektronischen Baugruppe.[1] Anwendung findet die Chip on Board Technologie in… …   Deutsch Wikipedia

  • papermaking — [pā′pər māk΄iŋ] n. the making of paper papermaker n. * * * pa·per·mak·ing (pāʹpər mā kĭng) n. The process or craft of making paper.   paʹper·mak er n. * * * Introduction       formation of a matted or felted sheet, usually of cellulose fibres,… …   Universalium

Share the article and excerpts

Direct link
Do a right-click on the link above
and select “Copy Link”